Water-Based Slurries

Industrial Diamond Lapping Slurries

W768 Slurries

Saint-Gobain’s W768 slurry line features cut-rate enhancers for aggressive cutting action during lapping along with lubricants that help reduce scratching and sub-surface damage to the work piece.

BLC40 Slurry

Saint-Gobain’s BLC 40 slurry features unique suspension additives that easily disperse diamond particles through electrostatic repulsion. BLC40 is specially formulated with environmentally friendly lubricants that produce a very smooth surface after lapping.

W809 Slurries

Saint-Gobain Surface Conditioning's W809 series of water-based diamond suspension slurries feature additives that prevent agglomeration of particles which helps to minimize scratches, and cut-rate enhancers for aggressive cutting action. W809 slurries can achieve below 10 A surface roughness on single crystal substrates, making them ideal for use before the final CMP step.

W809NDS is designed for pre-polishing wafers such as SiC and other hard crystals before CMP.

W809HNS is designed for pre-polishing wafers such as GaN and other hard crystals before CMP.

Benefits

• Provides excellent wetting and spreading of slurry during the lapping process
• Reliable performance and user-friendly for high volume manufacturing processes
• Keeps the plate running cool during lapping, making it ideal for high volume lapping operation
• Provides fast material removal rate and controlled surface finish
• Field tested and industry approved
• Contains no petroleum distillates
• Knowledgeable application engineers available for technical support