ThermoFil
ThermoFil is a next generation alpha alumina, developed to provide high thermal conductivity to improve thermal interface management, thanks to its high Alpha Alumina purity.
- Ideal for high power devices data centers, servers and routers that require managed thermal output
- Provides good dispersion and packing behavior in filler/coating applications
- Supplied in powdered form allowing customization for your application and specifications
- ThermoFil provides a high performance solution to heat management and dispersion

Applications
While designed as a thermal interface management product, ThermoFilhas shown to be a valuable product in a broader range of applications:
- Fillers and coatings: thermal/gap pad fillers, anti-scratch coatings and films, personal protection, cut-resistance, thermal spray coatings
- Industrial finishing: Stone/granite polishing, precision ball bearing finishing, roll polishing, medical implant polishing
- Metallography
Features & Benefits:
- Particle purity >99%
- Size distribution and shape
- Sustainably produced
Typical Properties:
Characteristics | Value |
---|---|
Primary size particle | D0.1 477.0 nm D5 292.0 nm D50 161.1 nm D70 135.0 nm |
SSA (dried and crushed powder) | 28.0 m2/g |
Moisture% | 1-5 |
Sieve -78 mesh (final powder product) | 100% |