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                      5. CMP Slurries for SiC Polishing

                      CMP Slurries for SiC Polishing

                      ClasSiC Slurries  | Saint-Gobain Surface Conditioning

                      Saint-Gobain Surface Conditioning ClasSiC™ alumina polishing slurries are high-precision slurries specifically formulated for the chemical mechanical planarization of silicon carbide wafers used in the fabrication of LED and power electronic devices. Made with Saint-Gobain’s nano alumina abrasives, ClasSiC™ CMP slurries greatly enhance removal rate and planarization performance, delivering an excellent surface finish on SiC wafers.

                      ClasSiC™ slurries are formulated with high-efficiency permanganate oxidizers, tightly sized engineered nano-particles, and accelerant chemistries that facilitate very low surface finish, defectivity and sub-surface damage on all SiC surfaces. These unique slurries provide exceptionally low TTV, LTV, and Warp values and deltas. ClasSiC™ slurries offer colloidal and oxidative stability, making them easy to manage and clean, thanks to Amberclean SCA17, developed specifically for ClasSiC™.

                      Benefits - ClasSiC™

                      • Exceptionally high removal rate
                      • Excellent surface finish
                      • Very low TTV
                      • Very low LTV
                      • Very low warp
                      • Very low scratch potential and defectivity
                      • Provides epi-ready surface of Si terminated side
                      • Excellent dispersion, cleanability and oxidative stability

                       

                      Benefits - Amberclean SCA17

                      • Highly efficient cleaner which degrades permanganate and aids in removing stuck/ surface bonded particle
                      • Shelf-stable formulation: no eventual deactivation and no outgassing/ bloating during storage
                      • Formulated without the use of VOC’s
                      • Intended to be used for all cleaning needs where ClasSiC slurries come in contact with – wafers, pads, tooling, and factory surroundings

                       

                      • ClasSiC™ 100
                      • ClasSiC™ 102 V
                      • ClasSiC™ 707
                      • ClasSiC™ 707 X
                      • Amberclean SCA17
                      • Other Possibilities
                      • Removal rate: up to 3 μ/hr in a batch process
                      • Up to 6μ/hr in a single wafer process
                      • Surface Finish: <2.5Å
                      • Removal rate: 1μ/hr
                      • Surface Finish: down to 1 Å

                      Removal rate:

                      • 6μ/hr in a batch process
                      • >10μ/hr in a single wafer process
                      • Removal rate: up to 2μ/hr
                      • Can be concentrated up to 3x

                      Contact us to learn how Saint-Gobain will work with you to formulate a custom ClasSiC slurry for your unique CMP requirements.

                       Contact us

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                      Saint-Gobain Surface Conditioning is a business of Saint-Gobain Ceramic Materials

                       

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