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                      ClasSiC™ CMP Slurries for SiC Polishing

                      ClasSiC™ CMP Slurries for SiC Polishing

                      ClasSiC Slurries  | Saint-Gobain Surface Conditioning

                      Saint-Gobain Surface Conditioning ClasSiC™ alumina polishing slurries are high-precision slurries specifically formulated for the chemical mechanical planarization of silicon carbide wafers used in the fabrication of LED and power electronic devices. Made with Saint-Gobain’s nano alumina abrasives, ClasSiC™ CMP slurries greatly enhance removal rate and planarization performance, delivering an excellent surface finish on SiC wafers. 

                      ClasSiC™ slurries are formulated with high-efficiency oxidizers, tightly sized engineered nano-particles, and accelerant chemistries that facilitate very low surface finish, defectivity and sub-surface damage on all SiC surfaces. These unique slurries provide exceptionally low TTV, LTV, and Warp values and deltas. ClasSiC™ slurries offer colloidal and oxidative stability, making them easy to manage and clean. 

                      Benefits

                      • Exceptionally high removal, >2μ/hr.
                      • Excellent surface finish, typically <2.5Å
                      • Very low TTV, <3μ with Δ <1μ
                      • Very low LTV, <1.5μ with Δ <0.5μ
                      • Very low warp, <20μ with Δ <1μ
                      • Very low scratch potential and defectivity
                      • Provides epi-ready surface of Si terminated side
                      • Excellent dispersion, cleanability and oxidative stability

                       

                      • ClasSiC™ 100
                      • ClasSiC™ 101
                      • Other Possibilities
                      • Nano alumina-based CMP slurry
                      • SiC removal rate up to 2μ/hr. (Si face) & 5μ/hr. (C face)
                      • Low TTV, LTV and warp, with Δ<1μ
                      • Use pH = 2.0 to 2.5
                      • 1 year shelf life or longer
                      • Nano alumina-based CMP slurry
                      • Enhanced oxidative and accelerant performance
                      • Superior dispersion performance
                      • SiC removal rate up to 2.5μ/hr (Si face) & 5.5μ/hr (C face)
                      • Low TTV, LTV and warp, with Δ<1μ
                      • Use pH = 2.0 to 2.5
                      • 1 year shelf life or longer

                      Contact us to learn how Saint-Gobain will work with you to formulate a custom ClasSiC slurry for your unique CMP requirements.

                       Contact us

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