Saint-Gobain Surface Conditioning ClasSiC™ alumina polishing slurries are high-precision slurries specifically formulated for the chemical mechanical planarization of silicon carbide wafers used in the fabrication of LED and power electronic devices. Made with Saint-Gobain’s nano alumina abrasives, ClasSiC™ CMP slurries greatly enhance removal rate and planarization performance, delivering an excellent surface finish on SiC wafers. 

ClasSiC™ slurries are formulated with high-efficiency oxidizers, tightly sized engineered nano-particles, and accelerant chemistries that facilitate very low surface finish, defectivity and sub-surface damage on all SiC surfaces. These unique slurries provide exceptionally low TTV, LTV, and Warp values and deltas. ClasSiC™ slurries offer colloidal and oxidative stability, making them easy to manage and clean. 

Benefits

• Exceptionally high removal, >2μ/hr.
• Excellent surface finish, typically <2.5Å
• Very low TTV, <3μ with Δ <1μ
• Very low LTV, <1.5μ with Δ <0.5μ
• Very low warp, <20μ with Δ <1μ
• Very low scratch potential and defectivity
• Provides epi-ready surface of Si terminated side
• Excellent dispersion, cleanability and oxidative stability