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2019
December 9th - December 9thEliminating Surface Roughness in Electronic Substrates Surface roughness is a property that defines the three-dimensional (3D) structure of a substrate’s uppermost surface layers. It is a complex characteristic that is typically characterized by material-specific features or process marks – or a combination of the two. In the context of electronic substrates, surface roughness is an intermediary |
November 25th - November 25thChemical mechanical planarization, usually abbreviated to CMP, has proven an enabling technology for the increasingly diverse field of semiconductor devices. It was initially discounted for precision polishing applications but has become a mainstay in the development of complementary metal-oxide-semiconductors (CMOS) and planar substrates for |
November 14th - November 14thSurface Preparation for Car Polishing Car polishing and detailing is an oddly intimidating process for many vehicle owners. It straddles the boundary between aesthetics and mechanics, often deemed an afterthought while other times becoming as integral to vehicle performance as any other aspect of car care. To reduce the risk that mild visual flaws will become a serious problem down |
October 17th - October 17thImportance of Polishing Processes in Microelectronics Microelectronics are embedded into practically every aspect of modern life, from personal devices to large-scale infrastructural controllers. The term is often used to describe electronic components with extremely small dimensions; specifically, components with microscopic elements (capacitors, conductors, diodes, inductors, resistors, |
September 30th - September 30thModifying Abrasive Media for Automotive Polishing There are virtually limitless different compounds and solutions available on the automotive polishing market today. Although each one features a structurally similar composition (particles of abrasive media suspended in a continuous phase solution), their performance capabilities vary dramatically from product to product. This difference in |
September 20th - September 20thChemical Mechanical Planarization: Enabling New Electronics Chemical mechanical planarization (CMP) is a fundamental technology in the modern landscape of consumer and industrial electronics. It provides unmatched topographical uniformity for high-precision electronic wafers, laying the groundwork for downstream etching or deposition processes. Global planar uniformity is pivotal to the success of both |
August 26th - August 26thAchieving the Ideal Surface Finish: Car Polishing Tips Car polishing is widely considered something of an art form, largely left to skilled professionals with years of experience in paint correction and surface finishing. Professional detailers are trusted to maintain, and in some cases recover, the depth of color and shine of a vehicle’s paintwork. |
August 19th - August 19thGrinding Wheel Substrate Surface Preparation Grinding is one of the oldest methods of surface preparation in human engineering. In fact, modern grinding wheels that are used to finish extremely hard substrates with sub-micrometer (µm) scales of precision, are based on a simple tool that has existed since at least 830 CE (Common Era). The grindstone is a round block of an abrasive mineral |
August 12th - August 12thAutomotive Polishing: Balancing Cut Rate with Surface Finish In an ideal world, automotive polishing compounds would precisely balance a high-cutting action with a uniform final surface finish to offer true single-step paint correction. The reality is that readily-available single-step compounds are often just a temporary solution to a long-term problem. These compounds are usually engineered with blocky |
August 2nd - August 2ndEnhanced Alumina Particles for Abrasive Applications Aluminum oxide (Al2O3), also known as alumina, is derived from a natural ore called bauxite. Natural Al2O3 occurs as the mineral corundum and in its gemstone forms as sapphire and ruby; however, the term alumina usually refers to the manufactured material (1). |