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2021
March 5th - March 5thAbrasive Solutions: Biodegradable Coolants from Saint-Gobain Coolants are fluids that mitigate heat buildup in a process. These can be used in cutting, grinding and forming of materials, including metals, plastics and ceramics. These fluids work by carrying heat away from |
February 19th - February 19thUsing Cubic Boron Nitride in Abrasive Applications Cubic boron nitride is a unique crystalline form of boron nitride with exceptional thermomechanical properties. It has outstanding hardness approaching that of diamond, plus fantastic thermal stability with an |
2020
November 20th - November 20thPolishing Compounds & Slurries for Industrial Finishing There is no such thing as a universal abrasive for industrial finishing applications. Process engineers must pay holistic |
November 2nd - November 2ndThere is a definitive method when it comes to selecting the right polishing media for your workflow. Firstly, all solutions |
October 22nd - October 22ndCBN Abrasive: A Guide to Cubic Boron Nitride Cubic boron nitride (CBN) is a superb abrasive material designed specifically for advanced wear-resistant characteristics. It is a comparatively recent |
August 3rd - August 3rdWe are a Top Surface Technology Services Provider This month, Surface Conditioning was nominated as a Top Surface Technology Services company by the Manufacturing Technology Insights magazine. We are honored to receive this award as we strive to enable our customers to create their perfect surface. Special thanks |
2019
December 27th - December 27thDownstream Applications of CMP Polishing Chemical mechanical planarization (CMP) is a high-precision manufacturing technique used to remove minute volumes of surface material from substrates via chemically-assisted abrasion. It is primarily an intermediary manufacturing process that produces topographically-uniform semiconductor wafers for electrical and electronic equipment (EEE). |
December 9th - December 9thEliminating Surface Roughness in Electronic Substrates Surface roughness is a property that defines the three-dimensional (3D) structure of a substrate’s uppermost surface layers. It is a complex characteristic that is typically characterized by material-specific features or process marks – or a combination of the two. In the context of electronic substrates, surface roughness is an intermediary |
November 25th - November 25thChemical mechanical planarization, usually abbreviated to CMP, has proven an enabling technology for the increasingly diverse field of semiconductor devices. It was initially discounted for precision polishing applications but has become a mainstay in the development of complementary metal-oxide-semiconductors (CMOS) and planar substrates for |
November 14th - November 14thSurface Preparation for Car Polishing Car polishing and detailing is an oddly intimidating process for many vehicle owners. It straddles the boundary between aesthetics and mechanics, often deemed an afterthought while other times becoming as integral to vehicle performance as any other aspect of car care. To reduce the risk that mild visual flaws will become a serious problem down |