Chemical mechanical planarization, usually abbreviated to CMP, has proven an enabling technology for the increasingly diverse field of semiconductor devices. It was initially discounted for precision polishing applications but has become a mainstay in the development of complementary metal-oxide-semiconductors (CMOS) and planar substrates for

Microelectronics are embedded into practically every aspect of modern life, from personal devices to large-scale infrastructural controllers. The term is often used to describe electronic components with extremely small dimensions; specifically, components with microscopic elements (capacitors, conductors, diodes, inductors, resistors,

Chemical mechanical planarization (CMP) is a fundamental technology in the modern landscape of consumer and industrial electronics. It provides unmatched topographical uniformity for high-precision electronic wafers, laying the groundwork for downstream etching or deposition processes. Global planar uniformity is pivotal to the success of both