Diamond Particles

Diamond is a synthetic material used for its very high toughness.

Specifically used in grinding applications, it features unique properties allowing for grinding different types of materials: cemented carbides, glass, ceramics… It can also be used in other polishing applications. Its efficiency is recognized and maximizes productivity.

Diamond Particles
Metal Bond Mesh

Metal bond mesh diamond is a synthetic material, grown slowly, resulting in monocrystalline structures with high toughness. The typical blocky crystals are suitable for resin, metal and electroplated bond systems in applications such as grinding ceramics, cemented carbides and glasses. It is typically used in aerospace and automotive applications.

Our bond mesh diamond is typically 40µm and larger in particle size and is available in standard electroless nickel (Ni) coatings of 30% and 56% by weight, and a copper (Cu) coating of 50% by weight. Saint-Gobain’s electroless coated particles extend grinding wheel performance through improved heat removal from the grinding zone and increased abrasive adhesion in the bond system.

Metal Bond Micron

Metal bond micron diamond features monocrystalline structures with high toughness. The blocky crystals are suitable for resin, metal and electroplated bond systems. Main applications include grinding ceramics, cemented carbides and glasses. They are also extensively used in polishing and other surface conditioning applications.

Processed using state-of-the-art grading equipment, Saint-Gobain metal bond micron diamond provides well-controlled particle size distribution and surface cleanliness in a wide range of challenging applications.

Resin Bond Mesh

Saint-Gobain Surface Conditioning's resin bond mesh diamond is a synthetic material with a friable crystal structure for use in vitrified and resin bond systems. The crystals are irregular, elongated and rough-edged, and are suitable for grinding tungsten carbide, ceramics and glasses. 

The friability or breakdown of the diamond is a function of its polycrystalline structure and metallic inclusions within the grains. Grains are microfractured during grinding and new edges formed for efficient, free-cutting action

Resin bond mesh diamond is typically 40µm and larger in particle size and is available in standard electroless nickel (Ni) coatings of 30% and 56% by weight, and a copper (Cu) coating of 50% by weight.

Resin Bond Micron

Designed for use in vitrified metal and resin bond systems, Saint-Gobain Surface Conditioning's resin bond micron diamond is a synthetic material featuring a friable crystal structure. Widely used for lapping and surface conditioning on a diverse range of materials, resin bond micron diamond features irregular, elongated, rough-edged crystals that are ideal for grinding tungsten carbide, ceramics and glasses.*

The friability or breakdown of the diamond is a function of its polycrystalline structure and metallic inclusions within the grains. During grinding, grains are microfractured and new edges formed, providing efficient, free-cutting action.

Our resin bond micron diamond is processed using state-of-the-art grading equipment to ensure tightly controlled particle size distribution and surface cleanliness for a variety of demanding applications.

Polycrystalline

Saint-Gobain Surface Conditioning's polycrystalline micron diamond features a very rough surface morphology.
It maximizes productivity in lapping and polishing processes across a wide range of applications. We offer three polycrystalline types with varying shapes and properties designed to meet demanding surface finishing requirements in a variety of industries.

Applications: 

  • Compound semiconductor wafers (II-Vi & III-Vs)
  • Sapphire, silicon carbide, gallium nitride
  • Ceramics
  • HDD components — recording heads
  • Laser crystals — YIG, YAG
  • Optical and electro-optical crystals — lithium niobate and other oxide crystals
  • Hard brittle materials
  • Carbides