Chemical Mechanical Planarization (CMP)
Optimal Performance for a Range of Substrates
Saint-Gobain Surface Conditioning is a leading developer of high-performance abrasive powders and slurries for chemical mechanical planarization (CMP) polishing applications. We offer a range of material compositions, morphologies and particle sizes for mechanical polishing coupled with chemical formulations to provide the highest removal rate and best surface topography on any material substrate.
Through our state-of-the-art R&D center and application testing facilities, Saint-Gobain can simulate applications to develop new solutions for the CMP industry or work collaboratively with you to engineer a CMP formulation that meets your specific application.